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Sylke Becker

Director Press and Publications at VDW

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Overview: VDW Press Releases

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New METAV date set

09.03.2020

Frankfurt am Main, 9 March 2020. – METAV 2020 is postponed until March 2021. It will now be held from 23 to 26 March 2021. "We are delighted to have agreed a new date together with our partner, Messe Düsseldorf, so quickly," says Dr. Wilfried Schäfer, Executive Director of the METAV organ-iser VDW (German Machine Tool Builders' Association).
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METAV 2020 has been postponed

28.02.2020

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Data themed around the tool ensure transparent production

25.02.2020

High-precision tools have a key function in digital production operations. Application-tailored integration into the production sequences and purposeful processing of the tool data are the basis for up-to-the-future Industry 4.0 solutions.
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Cool technology – Special Youth Show presenting careers in mechanical and plant engineering

19.02.2020

Frankfurt am Main, 18 February 2020. – School students will be able to see for themselves how a Formula 1 racing car is created in the Special Youth Show at this year's METAV in Düsseldorf from 10 to 13 March 2020. Together with various partners, the Youth Education and Development Foundation for Mechanical Engineering (NWS) will be presenting the full production chain of these model cars.
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IT security in production – A major challenge for machine manufacturers

29.01.2020

Frankfurt am Main, 29 January 2020. – Almost daily reports of hacker attacks are unnerving the public. According to the results of a Deutsche Telekom survey, nearly two thirds of German companies have fallen victim to hacking at least once. The mechanical engineering industry, too, is experiencing a significant increase in attacks on its production facilities.
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The future is cyber-physical

20.01.2020

Frankfurt am Main, 20 January 2020. – Like many a successful TV series, industry thrives on innovations that build on previous successes. This applies in particular to the clamping technology industry, the products of which are currently morphing into cyber-physical devices.
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